Turnkey and Consigned Manufacturing.

 Surface Mount, Through-Hole and BGA Circuit Board Assembly (High Mix - Low and Medium Volume).

 Low and Medium Volume).

 Repairs and engineering changes.

 In-Circuit and Functional Test Development.

 Box Build/Final/Mechanical Assembly.

 ISO-9002 Certification.

 Automated Optical Inspection (AOI) .

 100% Quality Assurance Inspection.

 ESD and Environmental Controlled Facility.

 PCB Design and Layout.

 Product Design and Development.